- مبلغ: ۸۶,۰۰۰ تومان
- مبلغ: ۹۱,۰۰۰ تومان
The aim of this work is to produce two layered thin-walled Cu/Al composite tube by the spin-bonding process. The process is utilized to bond the aluminum tube into the copper one at thickness reductions of 20–60% and process temperatures of 25°C, 130°C, and 230°C. The bond strength is measured by T-peeling test, and the bond interfaces are examined by metallography and scanning electron microscopy (SEM). The results show that after a threshold thickness reduction of about 30%, the bond strength increased with the amount of deformation. SEM fractography of the peel surfaces confirms that the copper oxide film is broken in a shear manner during deformation. Severe shear strains applied during spin-bonding process, in fact, make it appropriate for bonding the copper to aluminum. Based on the results, at higher temperatures the resulted bond strength is decreased. It is shown that formation of the brittle intermetallic layer on the interface at high temperatures leads to decrease in the bond strength. In addition to the experiments, a procedure is proposed by which it is possible to calculate the bonding length through the comparison of FEM simulations and the experiments. Based on these calculations and the bonding mechanism, a bond strength model is developed and verified by the experiments.