Abstract
With the integration of the electronic devices on the printed circuit board, the heat flux density in narrow spaces is increasing rapidly. The placement of electronic devices can affect the temperature of the overall circuit board. In addition, some special devices usually need to meet many location requirements. For example, the devices such as FPGAs, ARMs and MCUs need to be placed in the central position of the PCB for the use of multiple peripheral circuits. In order to optimize the temperature of devices with a priori layout requirement, this paper uses the micro-element thermal equilibrium method to establish the temperature field model and then the ant colony algorithm with classified compensation is used to search optimized position of all components. Simulation experiment results show that the proposed algorithm can effectively reduce the maximum temperature of devices in the case of the electronic devices meet the needs of the circuit function.
